- 切割和磨边系统能够对硅、金刚石、宝石、GaAs、GaP、玻璃、 陶瓷、Geranium, III-V materials等材料做精密切割和独特的磨边处理，双极磨边和同时正负极磨边、返修、切槽和外型修正Edge Beveling Systems perform a multitude of precision cutting and beveling processes with exceptional c***istency as well as with excellent repeatability on silicon, silicon carbide, sapphire, NaG, GaAs, GaP, glass, ceramic, Geranium, III-V materials, and other hard brittle materials. Unique processes include double positive beveling, simultaneous positive and negative beveling, reworking, grooving, and contouring as well as removing the epitaxial edge crown, cutting discs (outside diameter), and holes (inside diameter). Systems include a Micro Sandblaster to deliver a c***istent flow of abrasive powder through a sapphire nozzle. The nozzle is precisely positioned by a sealed slide assembly for pinpoint accuracy around the substrate which is secured in place by a rotary vacuum chuck. A timer is integrated to regulate the process period for split second accuracy. With the rotational concentricity of the chuck assembly and the accuracy of the abrading process, the cutting to a diameter tolerance of 0.001" is possible. The Model B1 is ideal for single cut operati***. Please specify the material type to be cut and your electrical requirements when requesting for quote. In addition to manufacturing micro sandblasting equipment, Crystal Mark, Inc. operates an on-site job shop for companies requiring micro sandblasting services.
成都博成科技有限公司
普通会员第17年
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公司主营：销售自动点胶设备和双液灌封设备、激光剥线机和同轴半刚性剥线机、电子装联手工焊接设备、PCB板清洗和三...