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ALPHAOM338PT可针测无铅锡膏
FINE FEATURE PIN-TESTABLE LEAD-FREE SOLDER PASTE
DESCRIPTION
ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applicati***. ALPHA OM-338-PT’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-PT yields excellent print capability performance across various board designs; particularly with ultra fine feature repeatability (11 mil squares) and high “through-put” applicati***. ALPHA OM-338-PT is formulated to offer increased in-circuit pin test yields versus OM-338 without compromising electrical reliability.
Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-PT is formulated to deliver excellent visual joint co***etics. Additionally, ALPHA OM-338-PT’s capability of IPC Class III for voiding and ROL0 IPC classificati*** ensures maximum long-term product reliability.
*Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver.
FEATURES & BENEFITS
Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensi*** as ***all as 0.225mm (0.011”) with 0.100mm (4mil) stencil thickness.
Excellent print c***istency with high process capability index across all board designs.
Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput.
Wide reflow profile window with good solderability on various board / component finishes.
Excellent solder and flux co***etics after reflow soldering
Reduction in random solderballing levels, minimizing rework and increasing first time yield
Excellent pin-test yield for single and double reflow.
Meets highest IPC 7095 voiding performance classification of Class III.
Excellent reliability properties, halide-free material
Compatible with either nitrogen or air reflow
PRODUCT INFORMATION
Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu)
SA***05 (95.5%Sn/4.0%Ag/0.5%Cu)
Powder Size: Type 3, (25-45μm per IPC J-STD-005) and Type 4 (20-38μm per IPC J-STD-005)
Residues: Approximately 5% by (w/w)
Packaging Sizes: 500 gram jars
Lead Free: Complies with RoHS Directive 2002/95/EC.