上海戈曼机电代理销售日本AYUMI全金属超高真空 | 真空隔膜阀 | 电磁真空阀 | 超高真空闸阀 | 铝闸阀 | 真空三通阀 | 高真空L型阀 | 高真空蝶阀 |
日本AYUMI产品主要包括阀超高真空法兰垫片夹具固定,电流导入端子的超高真空各种真空元件同步真空组件,真空设备指南,连接器,无钎剂回流设备/减少的连接器,***仪,真空密封装置,有机质沉积设备,手套箱和气体净化设备,退火装置,液晶注入设备,各种类型的平板,显示器制造设备,真空设备,阀门,（如超高真空和真空金属膜片阀电磁真空阀）,
超高真空法兰,垫片,夹具,固定电流导入端子的超高真空,各种真空元件,同步真空组件
真空设备
该产品包括但不限于晶片和芯片键合机，真空密封系统，一个广泛系列的辉光箱，真空退火系统用于半导体和平板显示器的线条，以及真空部件的大的变化。
目前，产品在主流半导体线，微机电系，FPD线，与企业和大学的研发线中的应用。
晶圆键合系统
芯片到晶圆键合系统
***准系统
真空密封系统
真空气相蒸镀系统
手套箱和气体净化系统
退火系统
晶圆键合系统
Ayumi offers a series of bonders spread over a wide range to support following bonding methods.
- Direct Bonding
- Adhesive Bonding
- Anodic Bonding
- Glass-Frit Bonding
- Solder/Eutectic/ Diffusion Bonding
These bonders supports
- R&D to high volume manufacturing
- bond temperature from room temp to 900 C
- bond pressure from atm to 10-6Pa
- bond force up to 80 kN
- wafer size from 2” to 12”
- ex-situ and in-situ alignment
- alignment under ultra-high vacuum (10-6Pa)
*** Customized tool with any of above features are acceptable.****
Metal-metal bonding is an essential bonding technique for semiconductor, MEMS and LED packaging.
Ayumi has extended its mastered and well-proven ultra-high vacuum technology to manufacture thermo-compression bonding to meet any critical bond requirement in the industry. Ayumi has a series of equipment from R&D to HVM to meet different process requirement of customers. All these equipments h***e aligning module and bonding module clustered together so that there is no vacuum break between aligning and bonding.
The bonding system also comprised of forming gas treatment facility to remove metal oxide on the surface. As there is no vacuum break between forming gas treatment and bonding, only pure metal (no oxide) participate for bonding.
This assists in lowering the bond temperature. For example Cu-Cu bonding can be realized at 150 C.