IGBT模块 是由IGBT（绝缘栅 双极型晶体管 芯片）与FWD（续流二极管芯片）通过特定的电路桥接封装而成的模块化半导体产品；封装后的IGBT模块直接应用于变频器、 UPS不间断电源 等设备上；IGBT模块采用预涂热界面材料（TIM），能让电力电子应用实现一致性的散热性能。此外，IGBT模块可以借助压接引脚进行安装，从而实现无焊料无铅的功率模块安装。还能提供汽车级IGBT模块解决方案，以支持混合动力电动汽车的设计。IGBT一般分为IGBT单管和IGBT模块。简而言之IGBT电流密度高且功耗低，能够提高能效、降低散热需求，从而有效降低整体系统成本。它们应用于通用逆变器、太阳能逆变器、不间断电源（UPS）、感应加热设备、大型家电、焊接以及开关电源（***PS）等领域。
We currently stock over 12000+ branded products.
---Invensys Foxboro:
I/A Series system, FBM(input / output modules) Sequence control, ladder logic control, Recalling accident treatment, The digital-to-analog converter input/output signal processing, Data munication and processing, and etc.
---Invensys Triconex:
Redundancy fault tolerant control system, Based on the three module redundancy (TMR) structure of the most modern fault-tolerant controller.
---Westinghouse:
OVATIONN system, WDPF system, WESStation system card.
---Modicon:
Quantum 140 Series processor, control card, Power module and so on.
---Rockwell Allen-Bradley:
Reliance, SLC500/1747/1746, MicroLogix/ 1761/ 1763/ 1762/ 1766/ 1764, pactLogix/1769/1768,Logix5000/1756/1789/1794/1760/1788, PLC-5/1771/1785 and etc.
--- Industrial robot parts of DSQC series, Bailey INFI90, etc.
---Siemens: Siemens MOORE, Siemens Simatic C1, Siemens numerical control system, etc.
---Motorola: MVME162, MVME167, MVME1772 and MVME177 series.
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