No.6360-20
T:100um PO:90um Adhesive:10um High adhesion for chip flying
NO.636020 Dicing tape (for Wafer)
roduct Introduction
Dicing tapes (for wafer) c***ist of higher isotropic olefin backing and UV peeling adhesive.
Applicati*** and Features
- For all kinds of wafer dicing
- Dicing tape(for Wafer)
- High fixation power
Structure
Thickness (mm):0.100
General Property
| Test Item | Unit | Value | ||
| Adhesion | N/10mm | 3.20 | ||
| Tack | Ball No. | - | ||
| Holding power | Creep mm/24h | <0.1 | ||
| Adhesion | To UV | N/10mm | 0.22 | |
*Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N