JetEtch TotalProtect几乎可以开封目前市场上所有的集成电路芯片封装，而又不损坏芯片内部组件的电气属性。 美国Nisene科技集团有限公司从事集成电路失效分析的自动开封装置研发超过40年，拥有多项电化学及微波等离子开封机技术的专利。

        The JetEtch Pro TotalProtect is the world’s most advanced decapsulation system. With an unequaled feature set, the TotalProtect can etch the widest variety of any integrated circuits of any system on the market while maintaining the integrity of sensitive internal components. It is the new gold standard. Only from Nisene Technology Group.

主要特征（Features）:

• Sub-Ambient Cooling
• Daisy-Chaining Recipes
• Same Specs as the CuProtect

What It Does.

       The TotalProtect system comes equipped with all of the great features of the JetEtch Pro decapsulation system, as you might expect. It also comes with the patented bias voltage application process capability of the CuProtect. In addition to that, it ALSO has a special cooling feature that allows sub-ambient cooling of the etching acid. When combined with the bias application process, the TotalProtect offers the end user a tremendous range of etching parameters for virtually endless recipe combinati***. It’s the total package for total protection. It’s the JetEtch Pro TotalProtect.

开封样例 ---- SEM高倍率放大
 

Let Us Prove It To You.

        If you are interested in seeing what the TotalProtect can do and are interested in one of these systems for your facility, send us a set of samples and we’ll prove the concept for you free of charge.