AIM SN100C 锡丝/AIM SN100C锡膏/AIM SN100C锡条

AIM SN100C Glow Core锡丝

FEATURES

Fast Wetting with Pb-Free Alloys

Pleasant Odor

Clear Residue

Extends Solder Tip Life

ROL0 per IPC J-Std-004

REACH and RoHS Compliant*

Passes BONO Testing

DESCRIPTION

AIM SN100C Glow Core is a no-clean cored wire solder designed to offer excellent wetting characteristics with both leaded and lead-free alloys. The novel activator in Glow Core produces fast cycle time and powerful capillary action. AIM SN1000C Glow Core promotes thermal transfer, offering better solder penetration into plated through holes or surface mount interconnecti***. Glow Core cored wire produces low-to-medium post-process residues that are electrically safe that do not require cleaning.

AIM SN100C锡膏

AIM SN100C NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can attain the ***T soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes.AIM SN100C NC259 provides excellent print definition and sustainable solder volume transfer as the demand for ***aller pads grows. Proven to mitigate head-in-pillow defects, AIM SN100C NC259 reduces rework and rejected board costs to the manufacturer. AIM SN100C NC259 is formulated to provide one of the longest pause-to-print windows in the industry resulting in less solder waste, fewer restart costs and improved overall quality of prints. The long stencil life and shelf-life results in far less waste than traditional solder pastes. The extremely broad process window of NC259 allows assemblers with high density, high mix boa*** to run without timely set up. AIM SN100C NC259 also offers extremely low post process residues, which remain crystal clear after soldering.

AIM SN100C锡条

AIM SN100C is a lead-free solder alloy developed by Nihon Superior in Japan. AIM SN100C offers user-friendly properties and has been proven in commercial production since 1999. The addition of nickel improves the wetting and flow properties of the cost effective tin-copper eutectic. This makes it possible to achieve excellent results in w***e soldering at process temperatures comparable to the tin-lead solder it replaces. Performance in w***e soldering at least matches that of more expensive silver-containing alloys and the resulting joints are ***oother and brighter. AIM SN100C is ***ailable in bar, solid and cored wire, and solder paste.