Interflux® IF 2005C is a low solids no-clean flux, especially developed for selective soldering in lead-free and SnPb applicati***. It is the version of the IF 2005- series with the largest process window in activity.
Interflux IF 2005C is also suitable for w***e soldering but IF 2005K and IF *** are the first choice for respectively lead-free and SnPb w***e soldering.
Interflux IF 2005C has excellent solderability with lead-free alloys and on virtually all finishes (NiAu, I-Sn, HAL, Cu-OSP,…). It is resistant to elevated preheat temperatures, and to long contact times with a higher working temperature. This makes IF 2005C the best choice for selective soldering.
This absolutely halide free flux meets the EN, Bellcore and IPC requirements. It is formulated to provide the best combination of solderability, ease of processing and highest reliability.
All flux components can evaporate during the soldering process. This means also the most safe no-clean flux for high-end electronics. With no rosin nor resin to create sticky residue, there is nothing left behind after soldering to foul test pins or prevent electrical contact. The flux is classified as OR/L0 according to EN and IPC standa***.