1.Features
.Halogen-Free per EN14582 test method
.High transfer effi ciency through ***all apertures
(. 0.66AR)
.Eliminates hot and cold slump
.High oxidation resistance
.Wets well to oxidized BGA and pad surfaces
.Excellent soldering performance under high temperature
and long refl ow processes
.Clear, probe testable fl ux residue
.Backward compatible with Sn/Pb alloys
2.Introduction
Indium8.9HF is an air refl ow, no-clean solder paste
specifi cally formulated to accommodate the higher
processing temperatures required by the Sn/Ag/Cu,
Sn/Ag, and other alloy systems f***ored by the electronics
industry to replace conventional Pb- bearing solders.
Indium8.9HF offers unprecedented stencil print transfer
effi ciency to work in the broadest range of processes.
In addition, the high probe testability of Indium8.9HF
minimizes false failures in ICT.